Aux Channel design flaw or bug ???

Hi !
I only ever need to use the Aux channels because the Buss channels don't allow you to insert a Send. A rather unwieldy solution to an otherwise simple requirement.
Now here's the problem. Irrespective of whether the Buss source and Aux is set to stereo or mono ( whatever config I try ) the aux can't receive the signal if the Buss channel is panned to the right !! Left input, no problem
Is this a design flaw, a bug, or is there something I'm missing ?
I know there is a workaround to this problem - the same Audio copied to multiple track channels, but that creates a rather inelegant mixer.
I've also read elsewhere in this forum about delay/phase problems when using Aux channels.
Any pointers appreciated.
Thanks

Tele, I'm surprised that you'd make a comment like that.
It's easy to tell the bugs from the features: the bugs are when the features don't work. And there are ample enough features... I mean bugs... in Logic to help make that distinction.
Or did I really mean to say "enough bugs"...
Well, as Space Ghost once put it, "It's that easy, and it's that hard".
-=iS=-

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    * Published some numbers, to inform prospective customers about the durability of the laptop's case, e.g. in N/cm^2
    * Took our experience into consideration when designing their new laptops.
    Kind regards.

    " I need to understand what went wrong and, if possible, how to prevent this from happening in the future"
    So what's underneath the area w/ the "blister"?
    "It looks like the bottom base is only supported around its border. The middle of the bottom case has no backing to support it."
    That's pretty much been the case w/ every MBP I've ever had apart. Nothing past 2012 however.
    " While Apple could have designed a support structure around the battery cells and over the motherboard (logic board) and the back case, there is no support structure at all"
    In earlier versions of the MBP there is a "separator" between two areas of the upper case but it doesn't supply any support to the bottom case.
    So here's my take on this; Apple has made these MBPs thinner and thinner. In the MBPs I've taken apart 2008 - 2012. In the 2010 I have here the bottom case is very thick and judging by tapping on it is definitely tempered (or heat hardened or stress hardened). I don't have the proper caliper but the edge reads .044 Inch.
    There have been other issues on these communities that relate to the thinness of the top or the bottom cases in these newer machines.
    Never seen a newer machine but my feeling is judging by the issues seen around here is that the materials are much thinner and probably not as hardened or tempered.
    " how “excessive” can the pressure be on a Macbook Pro inside a high-quality, padded backpack?"
    To help prevent this from happening again and if this were my MBP I would use/make a hardened case just for the laptop. Say two sheets of 1/4" hardboard w/ a 1/4" separator of  high density foam. Wait I'm describing a high quality laptop case.
    As Ogelthorpe says, backpacks are not the most delicate way of transporting a laptop. I've seen damage worse than this to laptops, iPads, iPhones, Kindles etc. Especially at the school where I was the main tech. I would say: "What happened to this?" and the kid would say: "I dunno it was just in my backpack".
    I've watched backpacks fall from shelves, get stuck in lockers and get smashed into each other in the hallway.
    I'm sure you're much more delicate w/ your MBP but as the saying goes ".... happenes!"

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    There are online Mac reaper shops that will fix your bezel, it's nothing really.
    Here's one
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    Here's another
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    (no comp)

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