OEM thermal compound not adequately applied?

The last two laptops I have had, have had overheating issues that were solved by removing the original thermal compound, and applying arctic silver 5. This current laptop (see sig), has had slight fan issues every since I bought it three years ago. There was one program that utlized flash (Encyclopedia Britannica) that would start my fan running loudly every time I started the program. After applying new thermal compound, I started that program and the fans stayed silent. And this laptop has been very silent (meaning, no fans) continually since this new application of compound.
I'm wondering now, if it would be worth the time and effort to tear down even a new laptop, as soon as any type of overheating issue presented itself, and take care of the paste. I'm suspecting that this laptop came out of the factory with a pretty crummy application, because after this new application, it has never been so quiet, not even in the first few weeks I owned it. It could also be that I shot compressed air and cleaned out a lot of dust, but I sincerely doubt there was much dust in this laptop when I first got it, and the fan was running a lot from the very first week I got it--that tells me that the issue was the thermal compound, not the dust.
Thoughts? Should people assume that the OEM thermal compound job was crummy?
Toshiba Satellite L755D-S5218
AMD A6-3400M Quad-Core CPU
8 gigs RAM
Windows 7
Solved!
Go to Solution.

Not exactly. It isn't just the paste type and application, but also how and where the system is used. My work laptop usually doesn't make it a year before it needs to be reapplied. It is used heavily, almost always running multiple programs at once, and is taken in and out of differing environments on a daily basis. The computer was built for this abuse, but some preventive maintenance is needed to keep it running smoothly.
I have had friends/neighbors, etc, bring me relatively new computers in the past(all different brands), with overheating issues, and sometimes it looks like the paste application is light, and other times it looks like it is just dried out. Could be a bad batch of paste, or just heavy usage taking a toll on it.
I look at thermal paste sort of like engine oil in your car. To keep it running smoothly, change it out on a scheduled interval.
Qosmio X875 i7-3630QM, 32GB RAM, OCZ SSD Qosmio X505 i7-920XM, PM55, 16GB RAM, OCZ SSD
Satellite Pro L350 T9900, GM45, 8GB RAM , Intel 320 SSD (my baby) Satellite L655 i7-620M, HM55, 8GB RAM, Intel 710 SSD (travel system)

Similar Messages

How much thermal compound should one apply

is less more or shold i just add a lot and have it squeece out?
im sandpapering a tt sink and it fastens with screws, i gues i shold sandpaper the screwes too to make them shorter so that the sink gets apropliatly close to the die.

Use very few of the termal compound. A thick layer will not help in conducting heat (it conducts better than air but not better than metal).
For Flip-Chips (were you can see the little die, like the Athlon XPs fr example) place just one very little drop at the center of the cpu die. The pressure from the heat sink will spread the compound over the whole cpu.
Olaf

What thermal compound goes with socket a antlon xp?? HELP!!

hey, i posted before, ive just sold me socket a processor, athlon xp 3000+, i desembled it so i can post it, just as some advice to the buyer when he re-assembles it, what compound should i recommend and how do you clean off the old stuff from the cpu and heatsink???
thanks much appreciated

YES USE COMPOUND
Make sure to remove ALL the old compound from CPU and HS
Clean the HS and CPU die surface thoroughly with alcohol just before installing compound on the processor.
The thermal compound should be applied so thin, you can almost see the text on the die through the compound. Do not use any on the heatsink just the CPU. Some recommend putting compound on the heatsink, then completely wiping it off... I disagree; I prefer that surface to be virgin clean. The compound on the die will do the job. Remember, the less you use the better the heat will transfer. Spread it with a strait razor or a credit card edge.
If you were to remove the heatsink after it has been installed properly, the text from the processor will leave an impression on the base of the heatsink where it came in contact. (of course it will appear reversed)
You can use Arctic silver or other silver based thermal compounds however I have never had a problem with the Radio Shack thermal compound and you do not have to worry about that stuff shorting out your processor like the silver based compound can.
Heat Sink lapping guide here if you like: http://www.a7vtroubleshooting.com/forum/cgi-bin/yabb/YaBB.pl?board=a7v;action=display;num=989258239

After applying thermal compound neither HD will boot.

This is too strange.. I installed a thermaltake hardcano5 about 3-weeks ago, which all went smoothly. Today I picked up some thermal compound (coolermaster premium t.c), which I applied to my heatsink as instructed, and then I layed the temp. sensor from the hardcano5 on the cpu (as instructed) and placed the heatsink on top. I closed up the case, powered up and the grub bootloader menu came up as usual, I scrolled down to winxp, hit enter and then was greeted by a blank black screen which stayed until I rebooted. I powered off and back up again and after choosing to boot xp again I was greeted by a blue screen which contained an apci error message, telling me to reboot. Again I rebooted and everytime since I get the blank, black screen. When booting linux the system locks after initializing the 2nd cdrom drive. (Please note, winxp / linux are on completely seperate drives). I am at a loss here, there were no changes made to the hardware, all that was done was positioning the heat sensor from the hardcano5 and applying the thermal compound. I am at a loss here and I need to get a number of c++ source files off one of the hdd's for class tomorrow, so any suggestions would be most appriciated. Thank you -
NicZak

If yo used silver grease, you may have shorted some of the bridges on the Athlon?? Too many people apply thermal compound as if they were buttering a sandwich. The thermal grease only has to fill the minute cavities on the surface of heatsink and CPU. therefore a microscopically thin layer will already do the job. More grease in some cases is worse then none.

Best way to apply thermal compound

I'm going to tear down my 3 year old laptop and apply thermal compound to the CPU. I do have a question.
Some instructions have said to apply it all over the cpu, other say to apply only a rice grain sized, and then push the heatsink onto the cpu and let the pressure from the heatsink push the thermal paste around.
What do people here say is best?
Toshiba Satellite L755D-S5218
AMD A6-3400M Quad-Core CPU
8 gigs RAM
Windows 7
Solved!
Go to Solution.

I guess whatever gets results. I would consider putting thermal compound on both surfaces a waste of material and also likely over-application which can sometimes give worse thermal performance and/or possibly cause other problems if excess thermal compund comes into contace with any other surface mounted devices. Oh well, glad it all worked out.
L305-S5955, T9300 Intel Core 2 Duo, 4GB RAM, 60GB SSD, Win 7 Ultimate 64-bit

Thermal compound replacement, RESULTS and PICTURES

YOU CAN HAVE A MACBOOK PRO THAT ISN'T SCORCHING HOT!!
(note that this will NOT fix any whine or moo; they are unrelated problems)
Here's how.
My Mother's Macbook Pro (Or Cookbook, if you will) Arrived a week ago today. I played around with it to make sure everything is alright because my mother doesn't know how to check for things like dead pixels, bad ram, or cough improperly applied thermal compound.
One of the first things I noticed after turning on the new MBP is how totally sweet it is! The second thing I noticed is how freaking hot it is: I recoiled in pain from the Fn key bar the first time I touched it. Disappointed, I started searching the web and sure enough, pretty much everyone who owns one is complaining that it's too hot for comfortable use.
Apple calling this a "notebook" instead of a "laptop" is a total semantic cop-out. It's a PORTABLE COMPUTER and I must be able to trust it around my dogs, children, valuables without the MagSafe burning up or the battery swelling and bursting.
I don't have objective figures for just how hot it was, but it was right about at my pain threshold above and below the belt, and sometimes over it. I couldn't hold my hand to it for more than a few seconds. In particular the area to the left of the touchpad was of concern. I do have before-and-after figures of the CPU and HDD; I invite yourselves to look at them:
Before After (Temps in degrees C, ambient 25 C)
50-60 26-35 CPU (idle)
76-85 56-65 CPU (load)
41 33 HDD
In particular the HDD figures are a great relief. HDDs are notoriously sensitive to temperature and even a few degrees C can cut their lifetimes significantly. Furthermore the area is now cool to the touch and I can once again rest my left palm on it without discomfort. The ranges are due to the fact that the sensor inside the core duo is flaky. In 5 seconds it can run anywhere from +-5 to +-10. Nevertheless it is accurate enough for our purposes. Below are photos, procedure, and a rough outline of test methodologies:
http://www.pbase.com/silentplummet/image/62641589
Here's the idle scenario before the procedure. The computer has been on for hours (days really) and I'm doing the work I normally do on it. TextEdit is open (to a little project I'm working on) with firefox and the temperature monitor. Alt-tab is to show that those are the only programs running. CPU temp is dead at 50 C. This is INSANE for an idle figure on ANY computer; desktop, laptop, "notebook" or otherwise.
http://www.pbase.com/silentplummet/image/62641590
The operation area and stress test. To stress the ATI chip I've jacked up the resolution, run a couple of quartz programs, SNES9x (a hardware emulator; the software shown is called "Energy Breaker") with a brutal multitasking OpenGL hardware renderer, and Google Earth. To get the CPU going I have Adobe's Lightroom processing thumbnails, and again SNES9x. For various I/O I have two shells executing yes > /dev/null, a USB mouse plugged in, and all the HDD access from lightroom. I figure it paints a pretty good picture of the "worst case scenario" of hardware stress for a laptop like this.
http://www.pbase.com/silentplummet/image/62641591
The CPU core(s) is at 76 C. I should note that at this point, as hot as the CPU is, overall the case is really not much hotter than it was before. In other words, it's just as unacceptable.
At this point I turned her off and dug in. I used a howto from Ifixit to serve as my guide. The procedure went without surprises until I got all the way to the logic board.
http://www.pbase.com/silentplummet/image/62641592
Dear lord!! That is an obscene amount of compound. It's casting a shadow over the rest of the board!! This gray gak is piled on so thick, it's no wonder the cooling system couldn't work effectively. It had even gotten all over components nowhere near the dies. That definitely cannot be good for their lifespan. Here's a shot of the heatpipe:
http://www.pbase.com/silentplummet/image/62641593
Terrible. Thermal compound has been squished out all over the place, including the chassis itself. This explains why it was getting so hot. A photo from the MBP service manual has been floating around the net, illustrating that this gross amount of compound is actually according to procedure.
http://www.pbase.com/silentplummet/image/62641594
Clean as a whistle. After removing the bulk of the compound with q-tips I used ArctiClean 2-step process to emulsify the rest and remove it with paper towels. You can see it's not perfect but it's close enough for me. I'm not overclocking this thing; I just want to run it "in spec" and have it not burn me. At this point, the CPU dies and the heat pipe interfaces should have mirror finishes. It's an overclocker's dream, and Apple already did the work for me.
http://www.pbase.com/silentplummet/image/62641595
This is how I applied Arctic Silver 5 to replace the compound I removed. Squeeze the tiniest little bit out of the syringe directly on to the die, and scrape it across with a flat edge (they recommend a razor blade but I just used a plastic ID card). Take the amount of compound you see on the Core Duo (on the right) and make a flat, even layer like the one you see on the ATI (left).
http://www.pbase.com/silentplummet/image/62641596
Turned it on and went straight for the hard stress test, after making sure everything was OK of course =) Wow! It reads 58 C in the screenshot, and doesn't go above 65C!! Moreover, there isn't even a bit of warmth above the Fn keys, and the HDD area is cool to the touch. I'd call this one a complete success. I'm idling right now and the temperature reads between 26 and 31C. Even the bottom is just slightly warm to the touch. Now I have a real laptop again!
So why did this happen?
There's a lot of confusion about the way the Macbook Pro cools itself. I admit it's confusing. Basically, Apple is shipping Macbook Pros with one cooling system, and replacing the thermal compound changes it into a very different system. Let me try to explain what I learned from digging around the hardware.
1. The built-in thermometer in the CPU is flaky. That's why you have to access it with a kernel extension and all kinds of hacks, and why Apple circumvented it completely in the cooling system. That's right: the MBP cooling system ignores the Core Duo temperature entirely.
2. The cooling system consists of a convective (my guess, I don't think anyone really knows what kind of) heatpipe which is in the base, directing heat out to two heatsinks which are then to be cooled by two fans if need be.
3. There are two temperature sensors. One is on the heatpipe itself, and the other one is on the chassis just next to the right fan. Probably the hardware monitors these temperatures and the differential between them to decide when to activate the fans and how long.
4. Behavior before the replacement procedure: The CPU core would get hot, hotter than I've ever seen a CPU go, at 80-85C. Most people confirm their MBPs also exhibit this. Where was this heat going? Well the fans didn't turn on until I put it at full load. Even when the fans did turn on, there wasn't much warm exhaust coming out of the vents at the back. The chassis heated up until it was unbearable, and most of the excess heat was being radiated away from it.
To sum up, the ineffective thermal interface between the CPU dies and the heat pipe was inhibiting heat from tripping the fan sensors. This explains why the fans didn't turn on until drastic temperatures were attained, and why the chassis got so hot. Essentially, the chassis was serving as a big heatsink for the CPU, which is the only reason it didn't overheat and shut down.
Effective, Apple, but not quite appropriate.
5. Behavior after the replacement procedure: The first thing you notice is that the fans scream from the second you turn the thing on. They aren't going full blast but pretty close to it. An effective thermal interface using an APPROPRIATE AMOUNT of AS5 (anything would do but I figured if I'm applying thermal compound, why not go for the authority) allows the heat to go straight from the cores into the heatpipe, tripping the sensor early and fast. The fans come on, I can feel hot air coming out the back, and the chassis now removed from the thermal equation is cool and comfortable again.
Of course, the thermal equation is different from before, and from the way Apple has tuned the fans to work from the factory configuration. This is more cooling than we probably need, and I foresee an update to Tiger allowing us to choose the thermal/noise tradeoff for ourselves.
Well, I hope that explains it, and I hope that those of you still suffering the abuses of your "in spec" MBP can take some hope from my findings, or are emboldened to go ahead and repeat the procedure yourself. I will post informative links here.
http://www.ifixit.com/Guide/85.1.0.html
http://www.arcticsilver.com/
http://forums.somethingawful.com/showthread.php?s=&threadid=1864582 (This is where I learned of the thermal paste issue)
Remember if you ever open up your MBP to NOT BREAK ANYTHING and please, always read the instructions before you reach in. =)

methanol, my conclusion is that Apple's specifications for thermal grease application are technically sound. As a corollary, I put the postings claiming that isn't so in the Urban Myth category.
There's a lot of technical literature on design and manufacturing specifications for thermal grease use, the kind of literature that appears in professional technical publications and is written by engineers. That literature supports Apple's thermal grease specifications. Putting it another way, Apple's engineers have a lot more technical training and experience than the average hobbyist who is working from the directions that came with Arctic Silver.
Yes, my computer has the "messy" looking application of thermal grease. No, it isn't inappropriate and doesn't need to be modified, and Apple did not make a quality assurance/quality control mistake.
Posts about the thermal grease modification began appearing several months ago, followed by Hardware Monitor charts showing considerable differences in "before fix" and "after fix" temperatures. I found, however, that I could easily replicate those before and after charts, and my computer compared favorably with the "after fix" temperature charts. Why? There was no quality control on the generation of the charts. And of course some owners damaged their computers in the process of taking them apart and putting them back together. Not a good idea, in my opinion.
Painstaking manual application of thermal grease might result in an insignificant drop in CPU temperature, perhaps 2 or 3C. Trying that in a mass production situation would result in more CPU failures.
True, some people got very significant reductions of case temperatures. That will happen if the sensors are not working (broken connection) and the fans run full out.

Thermal compound for G4 needed ?

I have a Quicksilver G4 (DP 1GHz) which ran trouble free(except CD/DVD Drive) for many years. One fine day I got kernel trap and not co-operating since.
When I press the power on button it lights up momentarily but no chime.
It did work for few hours after few days
I really like to revive it and I have done the following
1. Reset the PMU switch on logic board.
2. Replaced 3.7 Volt battery
3. Reseated all the PCI cards (Video, SCSI card, Ultra SCSI etc)
4. Checked the voltages on Power supply.
5. Cleaned all the dust (lot of it) on the fans and inside the tower.
Now I am planning to re-seat the processor card. For this I need to remove heat sink. I read in a website (http://www.jcsenterprises.com/Japamacs_Page/Blog/9AE7FE0E-0CF2-4A7C-8003-489B282 582BC.html) that *thermal compound* is a must.
But then in this forum and Apple Service manual I don't see any thermal compound mentioned for Heatsink for Powermac G4.
Now my concern is whether this is recommended step. I don't want to create new problems on top the existing ones.
I call on the experts...:)

Hi Japamac,
Thanks a lot for your help
I did put thermal compound and thought I had my G4 power mac back.
But now I have a dead machine which powered up once or twice.
I am guessing there is seating issue of CPU daughter board.
I did press firmly on the place where CPU pin attach to logic board
So my question instead of trying
1. Removing heatsink
2. Reseat CPU
3. Clean heat sink and apply compound
4. Put the heatsink
5. Pray and turn on the Powermac hoping I get it right this time
Can I just reseat CPU and then place the heatsink on Top and then turn on Power mac with out applying compound just for few minutes?
If it works then I apply comound and then put on heatsink. Then that is it .
Will the CPU go bad if I dont have compund on heatsink for few minutes..?
Appreciate your help

How good is the stock thermal compound on the Rx9800?

I can't overclock my card any higher than 410/370 w/o artifacting, yet when I touch the heatsink it is only mildly warm when I have a big fan on it. This leads me to believe that the stock thermal compound b/w the heatesink and chip is crappy... perhaps it's "just" enough to cool stock speeds, but is **** in overclocking.
Can someone give me some more info on this?

Just like overclocking a CPU, some clock higher than others, you may have one of those cards that just won't overclock very well.
The stock thermal compound is always going to be just fine, it's often the way it has been applied that's the problem.
I always pull the heatsink off and take a look at how it was applied. I usually end up putting a little more on the RAM and make sure it is spread evenly.
I try not to add to much, as excessive amounts can create heat buildup and slow dissipation.

Has anyone ever needed to replace thermal compound in a G5 PPC CPU?

I have a 1st generation iMac G5 (PPC) which becomes unresponsive after it gets warm, ie., spinning beach ball. I know the video processor uses thermal compound to couple to its heat sink but do not know if the CPU uses it? Does anyone have experience with that?

Yes, a thin, very thin, coating of Arctic Silver should do the trick.

Which thermal compound for a G4: Arctic Cooling MX-2, MX-3, or MX-4?

Thermal compound was mentioned at the below link:
[http://discussions.apple.com/thread.jspa?threadID=2613130&tstart=0]
Linked from that page was another web page, where the MX-2 thermal compound made by Arctic Cooling was mentioned. The below web page on the Arctic Cooling website mentions MX-2, as well as newer thermal compounds, MX-3 and MX-4:
[http://www.arctic-cooling.com/catalog/main.php?cPath=39]
Does anyone know which would be most appropriate for a G4 "Sawtooth"? According to the product descriptions, MX-3 is an upgraded version of MX-2.

Hi-
I'm using MX-3 now in all my G4s.
Previously, I used MX-2.
MX-3 is easier to apply, and definitely is more than good enough for any application you may have.
MX-3 outperforms AC Ceramique and requires no curing.
Ceramique receives a "Good" grade, whereas MX-2 (and MX-3 performs better) receives an "Excellent" grade:
http://benchmarkreviews.com/index.php?option=com_content&task=view&id=150&Itemid =62&limit=1&limitstart=11
http://benchmarkreviews.com/index.php?option=com_content&task=view&id=150&Itemid =62&limit=1&limitstart=12

Adobe Extension Manager CS6 update could not be applied

I have been trying to update my Adobe Extension Manager in CS6 to version 6.0.6 and when I do I receive the error: "update could not be applied ". The only option then is the close. How can this problem be corrected?
Note: I'm using Adobe Creative Suite 6 Design and Web Premium on Windows 7
Okay, I just tried uninstalling it and reinstalling after I deleted all mxi files/folders from BOTH "C:\ProgramData\Adobe\Extension Manager CS6\EM Store" AND "C:\Users\<UserName>\AppData\Roaming\Adobe\Extension Manager CS6 folders. I then tried installing the program again. I then tried updating it using Adobe Application Manager and again it fails and spits back the following code: U44M1P7. I opened the extension manager and checked on the version number mentioned which was 6.0.0.3.4.8 which to me is strange considering that I installed 6.0.6 after the uninstall.
I can get to the Adobe Extension Manager CS6 6.0.6 06-04-2013.log.gz file but I haven't a clue as to how to open it or attach it to this message.
Message was edited by: sperry1975

The error message in the log file is:
DF045: File corruption detected. Re-install the product & then apply the patch again. (Can not repair file "C:\Program Files (x86)\Adobe\Adobe Extension Manager CS6\Adobe Extension Manager CS6.exe")(Seq 13)
You can simply delete the "C:\Program Files (x86)\Adobe\Adobe Extension Manager CS6" folder, then download and install http://download.macromedia.com/pub/dw_exchange/extension_manager/win/AdobeExtensionManager 6.0.6All.zip. You will have the latest version of Extension Manager.

Logs are not getting applied in the standby database

Hello,
I have created a physical standby database and in it the logs are not getting applied..
following is an extract of the standby alert log
Wed Sep 05 07:53:59 2012
Media Recovery Log /u01/oracle/oradata/ABC/archives/1_37638_765704228.arc
Error opening /u01/oracle/oradata/ABC/archives/1_37638_765704228.arc
Attempting refetch
Media Recovery Waiting for thread 1 sequence 37638
Fetching gap sequence in thread 1, gap sequence 37638-37643
Wed Sep 05 07:53:59 2012
RFS[46]: Assigned to RFS process 3081
RFS[46]: Allowing overwrite of partial archivelog for thread 1 sequence 37638
RFS[46]: Opened log for thread 1 sequence *37638* dbid 1723205832 branch 765704228
Wed Sep 05 07:55:34 2012
RFS[42]: Possible network disconnect with primary database
However, the archived files are getting copied to the standby server.
I tried registering and recovering the logs but it also failed..
Follows some of the information,
Primary
Oralce 11R2 EE
SQL> select max(sequence#) from v$log where archived='YES';
MAX(SEQUENCE#)
37668
SQL> select DEST_NAME, RECOVERY_MODE,DESTINATION,ARCHIVED_SEQ#,APPLIED_SEQ#, SYNCHRONIZATION_STATUS,SYNCHRONIZED,GAP_STATUS from v$archive_dest_status where DEST_NAME = 'LOG_ARCHIVE_DEST_3';
DEST_NAME RECOVERY_MODE DESTINATION ARCHIVED_SEQ# APPLIED_SEQ# SYNCHRONIZATION_STATUS SYNCHRONIZED GAP_STATUS
LOG_ARCHIVE_DEST_3 MANAGED REAL TIME APPLY ABC 37356 0 CHECK CONFIGURATION NO RESOLVABLE GAP
Standby
Oralce 11R2 EE
SQL> select max(sequence#) from v$archived_log where applied='YES';
MAX(SEQUENCE#)
37637
SQL> select * from v$archive_gap;
no rows selected
SQL> select open_mode, database_role from v$database;
OPEN_MODE DATABASE_ROLE
READ ONLY WITH APPLY PHYSICAL STANDBY
Please help me to troubleshoot this and get the standby in sync..
Thanks a lot..

the results are as follows..
SQL> select process, status, group#, thread#, sequence# from v$managed_standby order by process, group#, thread#, sequence#;
PROCESS STATUS GROUP# THREAD# SEQUENCE#
ARCH CLOSING 1 1 37644
ARCH CLOSING 1 1 37659
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
ARCH CONNECTED N/A 0 0
MRP0 WAIT_FOR_GAP N/A 1 37638
RFS IDLE N/A 0 0
RFS IDLE N/A 0 0
RFS IDLE N/A 0 0
RFS RECEIVING N/A 1 37638
RFS RECEIVING N/A 1 37639
RFS RECEIVING N/A 1 37640
RFS RECEIVING N/A 1 37641
RFS RECEIVING N/A 1 37642
RFS RECEIVING N/A 1 37655
RFS RECEIVING N/A 1 37673
RFS RECEIVING N/A 1 37675
42 rows selected.
SQL>
SQL> select name,value, time_computed from v$dataguard_stats;
NAME VALUE TIME_COMPUTED
transport lag +00 02:44:33 09/05/2012 09:25:58
apply lag +00 03:14:30 09/05/2012 09:25:58
apply finish time +00 00:01:09.974 09/05/2012 09:25:58
estimated startup time 12 09/05/2012 09:25:58
SQL> select timestamp , facility, dest_id, message_num, error_code, message from v$dataguard_status order by timestamp
TIMESTAMP FACILITY DEST_ID MESSAGE_NUM ERROR_CODE MESSAGE
05-SEP-12 Remote File Server 0 60 0 RFS[13]: Assigned to RFS process 2792
05-SEP-12 Remote File Server 0 59 0 RFS[12]: Assigned to RFS process 2790
05-SEP-12 Log Apply Services 0 61 16037 MRP0: Background Media Recovery cancelled with status 16037
05-SEP-12 Log Apply Services 0 62 0 MRP0: Background Media Recovery process shutdown
05-SEP-12 Log Apply Services 0 63 0 Managed Standby Recovery Canceled
05-SEP-12 Log Apply Services 0 64 0 Managed Standby Recovery not using Real Time Apply
05-SEP-12 Log Apply Services 0 65 0 Attempt to start background Managed Standby Recovery process
05-SEP-12 Log Apply Services 0 66 0 MRP0: Background Managed Standby Recovery process started
05-SEP-12 Log Apply Services 0 67 0 Managed Standby Recovery not using Real Time Apply
05-SEP-12 Log Apply Services 0 68 0 Media Recovery Waiting for thread 1 sequence 37638 (in transit)
05-SEP-12 Network Services 0 69 0 RFS[5]: Possible network disconnect with primary database
05-SEP-12 Network Services 0 70 0 RFS[6]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 71 0 RFS[14]: Assigned to RFS process 2829
05-SEP-12 Remote File Server 0 72 0 RFS[15]: Assigned to RFS process 2831
05-SEP-12 Network Services 0 73 0 RFS[9]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 74 0 RFS[16]: Assigned to RFS process 2833
05-SEP-12 Network Services 0 75 0 RFS[1]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 76 0 RFS[17]: Assigned to RFS process 2837
05-SEP-12 Network Services 0 77 0 RFS[3]: Possible network disconnect with primary database
05-SEP-12 Network Services 0 78 0 RFS[2]: Possible network disconnect with primary database
05-SEP-12 Network Services 0 79 0 RFS[7]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 80 0 RFS[18]: Assigned to RFS process 2848
05-SEP-12 Network Services 0 81 0 RFS[16]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 82 0 RFS[19]: Assigned to RFS process 2886
05-SEP-12 Network Services 0 83 0 RFS[19]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 84 0 RFS[20]: Assigned to RFS process 2894
05-SEP-12 Log Apply Services 0 85 16037 MRP0: Background Media Recovery cancelled with status 16037
05-SEP-12 Log Apply Services 0 86 0 MRP0: Background Media Recovery process shutdown
05-SEP-12 Log Apply Services 0 87 0 Managed Standby Recovery Canceled
05-SEP-12 Remote File Server 0 89 0 RFS[22]: Assigned to RFS process 2900
05-SEP-12 Remote File Server 0 88 0 RFS[21]: Assigned to RFS process 2898
05-SEP-12 Remote File Server 0 90 0 RFS[23]: Assigned to RFS process 2902
05-SEP-12 Remote File Server 0 91 0 Primary database is in MAXIMUM PERFORMANCE mode
05-SEP-12 Remote File Server 0 92 0 RFS[24]: Assigned to RFS process 2904
05-SEP-12 Remote File Server 0 93 0 RFS[25]: Assigned to RFS process 2906
05-SEP-12 Log Apply Services 0 94 0 Attempt to start background Managed Standby Recovery process
05-SEP-12 Log Apply Services 0 95 0 MRP0: Background Managed Standby Recovery process started
05-SEP-12 Log Apply Services 0 96 0 Managed Standby Recovery starting Real Time Apply
05-SEP-12 Log Apply Services 0 97 0 Media Recovery Waiting for thread 1 sequence 37638 (in transit)
05-SEP-12 Log Transport Services 0 98 0 ARCa: Beginning to archive thread 1 sequence 37644 (7911979302-7912040568)
05-SEP-12 Log Transport Services 0 99 0 ARCa: Completed archiving thread 1 sequence 37644 (0-0)
05-SEP-12 Network Services 0 100 0 RFS[8]: Possible network disconnect with primary database
05-SEP-12 Log Apply Services 0 101 16037 MRP0: Background Media Recovery cancelled with status 16037
05-SEP-12 Log Apply Services 0 102 0 Managed Standby Recovery not using Real Time Apply
05-SEP-12 Log Apply Services 0 103 0 MRP0: Background Media Recovery process shutdown
05-SEP-12 Log Apply Services 0 104 0 Managed Standby Recovery Canceled
05-SEP-12 Network Services 0 105 0 RFS[20]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 106 0 RFS[26]: Assigned to RFS process 2930
05-SEP-12 Network Services 0 107 0 RFS[24]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 108 0 RFS[27]: Assigned to RFS process 2938
05-SEP-12 Network Services 0 109 0 RFS[14]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 110 0 RFS[28]: Assigned to RFS process 2942
05-SEP-12 Network Services 0 111 0 RFS[15]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 112 0 RFS[29]: Assigned to RFS process 2986
05-SEP-12 Network Services 0 113 0 RFS[17]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 114 0 RFS[30]: Assigned to RFS process 2988
05-SEP-12 Log Apply Services 0 115 0 Attempt to start background Managed Standby Recovery process
05-SEP-12 Log Apply Services 0 116 0 MRP0: Background Managed Standby Recovery process started
05-SEP-12 Log Apply Services 0 117 0 Managed Standby Recovery starting Real Time Apply
05-SEP-12 Log Apply Services 0 118 0 Media Recovery Waiting for thread 1 sequence 37638 (in transit)
05-SEP-12 Network Services 0 119 0 RFS[18]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 120 0 RFS[31]: Assigned to RFS process 3003
05-SEP-12 Network Services 0 121 0 RFS[26]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 122 0 RFS[32]: Assigned to RFS process 3005
05-SEP-12 Network Services 0 123 0 RFS[27]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 124 0 RFS[33]: Assigned to RFS process 3009
05-SEP-12 Remote File Server 0 125 0 RFS[34]: Assigned to RFS process 3012
05-SEP-12 Log Apply Services 0 127 0 Managed Standby Recovery not using Real Time Apply
05-SEP-12 Log Apply Services 0 126 16037 MRP0: Background Media Recovery cancelled with status 16037
05-SEP-12 Log Apply Services 0 128 0 MRP0: Background Media Recovery process shutdown
05-SEP-12 Log Apply Services 0 129 0 Managed Standby Recovery Canceled
05-SEP-12 Network Services 0 130 0 RFS[32]: Possible network disconnect with primary database
05-SEP-12 Log Apply Services 0 131 0 Managed Standby Recovery not using Real Time Apply
05-SEP-12 Log Apply Services 0 132 0 Attempt to start background Managed Standby Recovery process
05-SEP-12 Log Apply Services 0 133 0 MRP0: Background Managed Standby Recovery process started
05-SEP-12 Log Apply Services 0 134 0 Managed Standby Recovery not using Real Time Apply
05-SEP-12 Log Apply Services 0 135 0 Media Recovery Waiting for thread 1 sequence 37638 (in transit)
05-SEP-12 Network Services 0 136 0 RFS[33]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 137 0 RFS[35]: Assigned to RFS process 3033
05-SEP-12 Log Apply Services 0 138 16037 MRP0: Background Media Recovery cancelled with status 16037
05-SEP-12 Log Apply Services 0 139 0 MRP0: Background Media Recovery process shutdown
05-SEP-12 Log Apply Services 0 140 0 Managed Standby Recovery Canceled
05-SEP-12 Remote File Server 0 141 0 RFS[36]: Assigned to RFS process 3047
05-SEP-12 Log Apply Services 0 142 0 Attempt to start background Managed Standby Recovery process
05-SEP-12 Log Apply Services 0 143 0 MRP0: Background Managed Standby Recovery process started
05-SEP-12 Log Apply Services 0 144 0 Managed Standby Recovery starting Real Time Apply
05-SEP-12 Log Apply Services 0 145 0 Media Recovery Waiting for thread 1 sequence 37638 (in transit)
05-SEP-12 Network Services 0 146 0 RFS[35]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 147 0 RFS[37]: Assigned to RFS process 3061
05-SEP-12 Network Services 0 148 0 RFS[36]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 149 0 RFS[38]: Assigned to RFS process 3063
05-SEP-12 Remote File Server 0 150 0 RFS[39]: Assigned to RFS process 3065
05-SEP-12 Network Services 0 151 0 RFS[25]: Possible network disconnect with primary database
05-SEP-12 Network Services 0 152 0 RFS[21]: Possible network disconnect with primary database
05-SEP-12 Remote File Server 0 153 0 Archivelog record exists, but no file is found
05-SEP-12 Remote File Server 0 154 0 RFS[40]: Assigned to RFS process 3067
05-SEP-12 Network Services 0 155 0 RFS[37]: Possible network disconnect with primary database

Null offset from calibration not being applied to output

I am measuring some load cells using a I 9237. I am setting the null offset using Device > Bridge Calibration in the DAQ Assistant. I measure the offet and hit calibrate. It says "Calibration successful" and I hit finish, but the offset value is not applied to the data.
How do I get this to work?

Hello IamRubber,
How can you see the calibration not being applied? Are you running the same DAQ Assistant to see the offset? If possible, please attach a screenshot from before/after running bridge calibration.
Patrick W.
Applications Engineer
National Instruments

Policy not being applied to users

I have a group policy that used to work, but now has decided it does not want to be applied to the workstations anymore. I don't know what may have happened to make is stop working.
It's a pretty restrictive policy for students. I have the exact same policy for two other groups of students that still work. All three policies were copied from the same set of files. In other words, I make a change to one, then copy the files to the other two because they reside on different servers. Yes, I do open each one in C1 to update the timestamp.
When I run wmsched, the policy is there in the list, but the settings are not applied. I can log in to the PC with one of the other student accounts and their policy is applied.
The login I'm using to test with has R rights to the policy location - the same rights that the other users have to their policies. I have also tried more rights with no different results.
The DLU part of the policy runs, and I have turned off the windows firewall. I have also created a brand new policy from scratch to rule out any corruption in the old policy and I get the same results.
Apparantly, my workstation policy for this group is not being applied either. The other two groups' policies apply like they are supposed to. So this means that neither policy assigned to this group of students/workstations is working.
Any ideas?
Thanks

FishEggStew,
It appears that in the past few days you have not received a response to your
posting. That concerns us, and has triggered this automated reply.
Has your problem been resolved? If not, you might try one of the following options:
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the other self support options and support programs available.
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correct newsgroup. (http://forums.novell.com)
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I recieved a notice that there was an update for Elements 13 but when I try to install it it stop's half way through then I get the error message that "updates could not be applied" I have tried several times and it continues to give me the error. What is

I get a message that an update is available and when I install it the update stops half way through and I get the error code: U44M1I210 for Camera Raw and Elements 13.1 updates. I get the message "UPDATES COULD NOT BE APPLIED" Can someone help with this? Thank you. David

drmeyers381
Thanks for the follow up.
Is your Premiere Elements 13 on Mac computer?
I have not seen much in the way of alternatives coming from Adobe on the Premiere Elements 13.1 failed updates.
But there seems to be several discussions on U44M11210 in the CC products...one
Update failure. (U44M1I210) | Adobe Community
You could try the uninstall, free ccleaner, reinstall with antivirus and firewall(s) and then try for the Help Menu/Update for 13.1..
If Mac, https://www.piriform.com/mac/ccleaner
If Windows, CCleaner - PC Optimization and Cleaning - Free Download
The CC people seem to have the advantage of an online download of their update as well as the one via the Help Menu/Update.
Premiere Elements does not have that perk - update only via Help Menu/Update.
Please review and consider and please let us know of your progress as your schedule permits.
Thank you.
ATR

OEM thermal compound not adequately applied?

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