Question about GenIL programming for CRM 7.0

Hi All, I am confused in GenIL programming in CRM 7.0, pls help.
1 Why there are 2 methods related to object method execution u201CIF_GENIL_APPL_INTLAYEXECUTE_OBJECT_METHODu201D and u201CIF_GENIL_APPL_INTLAYEXECUTE_OBJECT_METHOD2u201D, as I debugged, the former one will be called whatever the return type is Object or DDIC and I don't know how "EXECUTE_OBJECT_METHOD2" could be called.
2 whatu2019s the usage of Object with Type u201CSearch Result Objectsu201D? I see it could combine data into result. But how to use it? Is there any sample for it?
3 whatu2019s the usage of Object with Type u201CView Objectsu201D? Is there any sample for that?
4 the best practice of using u201CIF_GENIL_APPL_INTLAYON_AFTER_COMMITu201D and u201CIF_GENIL_APPL_INTLAYON_AFTER_ROLLBACKu201D? whatu2019s the general purpose of those two methods? in it, what should I do and what should not do?
Thanks.

Hi Richard,
I am going to try and tackle all four at once. The answers are not complete clarifications, but should give you a good start. I am not logged into a system to check everything right now.
1.
As far as I recall the two methods differ in ther signature. METHOD() will only allow you to pass flat values and recieve flat values whereas METHOD2() gives you the ability to at least recieve references to objects and data.
2.
Your assumption is right. Result objects are exactly for the purpose to combine data of different areas into one handy object in a result list. The are create on the fly. Meaning there is no implementation class. Just specify them in your BOL dynamic query as resu lt object and fill the structure accordingly. It is just a nice thing to have on the UI. Logic for data fetching is combined in one central place. Can be reused everywhere
3.
Same as 2.. From my experience you can include view objects in the model hierarchy. For instance when fetching data from a remote destination and just displaying it on the UI.
4.
Looks to me like methods for implementing your own GenIL component and/or Root Object. In these two cases you would want to get information about the BOL transaction context. Cleanup your stuff or initialize. Have a look at the BP component. It is rather cleanly implemented. BT tends to be a little bit cetralized around CRM_ORDER_MAINTAIN.
Hope it helps. I held trainings concerning those topics and it is a topic I could go on about for at least an hour. BOL and GenIL are badly documented and there are many pitfalls.
cheers Carsten

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Hi
princejack,
Thanks for
posting on National Instruments forum.
The behavior
you have is completely normal. You can control the number of row displayed in
the legend and this rows are linked to the data you send to your graph. Thus,
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Benjamin R.
R&D Software Development Manager
http://www.fluigent.com/
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PXI 2527 & PXI 4071 -Questions about EMF considerations for high accuracy measurements and EMF calibration schemes?

Hi!
I need to perform an in-depth analysis of the overall system accuracy for a proposed system. I'm well underway using the extensive documentation in the start-menu National Instruments\NI-DMM\ and ..\NI-Switch\ Documenation folders...
While typing the question, I think I partially answered myself while cross-referencing NI documents... However a couple of questions remain:
If I connect a DMM to a 2 by X arranged switch/mux, each DMM probe will see twice the listed internal "Differential thermal EMF" at a typical value of 2.5uV and a max value of less than 12uV (per relay). So the total effect on the DMM uncertainty caused by the switch EMF would be 2*2.5uV = 5uV? Or should these be added as RSS: = sqrt(2.5^2+2.5^2) since you can not know if the two relays have the same emf?
Is there anything that can be done to characterize or account for this EMF (software cal, etc?)?
For example, assuming the following:
* Instruments and standards are powered on for several hours to allow thermal stability inside of the rack and enclosures
* temperature in room outside of rack is constant
Is there a reliable way of measureing/zeroing the effect of system emf? Could this be done by applying a high quality, low emf short at the point where the DUT would normally be located, followed by a series of long-aperture voltage average measurements at the lowest DMM range, where the end result (say (+)8.9....uV) could be taken as a system calibration constant accurate to the spec's of the DMM?
What would the accuracy of the 4071 DMM be, can I calculate it as follows, using 8.9uV +-700.16nV using 90 days and 8.9uV +- 700.16nV + 150nV due to "Additional noise error" assuming integration time of 1 (aperture) for ease of reading the chart, and a multiplier of 15 for the 100mV range. (Is this equivalent to averaging a reading of 1 aperture 100 times?)
So, given the above assumptions, would it be correct to say that I could characterize the system EMF to within 8.5uV+- [700.16nV (DMM cal data) + 0.025ppm*15 (RMS noise, assuming aperture time of 100*100ms = 10s)] = +-[700.16nV+37.5nV] = +- 737.66nV? Or should the ppm accuracy uncertainties be RSS as such: 8.5uV +- sqrt[700.16nV^2 + 37.5nV^2] = 8.5uV +-701.16nV??
As evident by my above line of thought, I am not at all sure how to properly sum the uncertainties (I think you always do RSS for uncertainties from different sources?) and more importantly, how to read and use the graph/table in the NI 4071 Specifications.pdf on page 3. What exactly does it entail to have an integration time larger than 1? Should I adjust the aperture time or would it be more accurate to just leave aperture at default (100ms for current range) and just average multiple readings, say average 10 to get a 10x aperture equivalent?
The below text includes what was going to be the post until I think I answered myself. I left it in as it is relevant to the problem above and includes what I hope to be correct statements. If you are tired of reading now, just stop, if you are bored, feel free to comment on the below section as well.
The problem I have is one of fully understanding part of this documenation. In particular, since a relay consists of (at least) 2 dissimilar metal junctions (as mentioned in the NI Switch help\Fundamentals\General Switching Considerations\Thermal EMF and Offset Voltage section) and because of the thermo-couple effect (Seebeck voltage), it seems that there would be an offset voltage generated inside each of the relays at the point of the junction. It refeers the "Thermocouple Measurements" section (in the same help document) for further details, but this is where my confusion starts to creep up.
In equation (1) it gives the expression for determining E_EMF which for my application is what I care about, I think (see below for details on my application).
What confuses me is this: If my goal is to, as accurately as possible, determine the overall uncertainty in a system consisting of a DMM and a Switch module, do I use the "Differential thermal EMF" as found in the switch data-sheet, or do I need to try and estimate temperatures in the switch and use the equation?
*MY answer to my own question:
By carefully re-reading the example in the thermocouple section of the switch, I realized that they calculate 2 EMF's, one for the internal switch, calculated as 2.5uV (given in the spec sheet of the switch as the typical value) and one for the actual thermocouple. I say actual, because I think my initial confusion stems from the fact that the documenation talks about the relay/switch junctions as thermocouples in one section, and then talks about an external "probe" thermocouple in the next and I got them confused.
As such, if I can ensure low temperatures inside the switch at the location of the junctions (by adequate ventilation and powering down latching relays), I should be able to use 2.5uV as my EMF from the switch module, or to be conservative, <12uV max (from data sheet of 2527 again).
I guess now I have a hard time believeing the 2.5uV typical value listed.. They say the junctions in the relays are typically an iron-nickel alloy against a copper-alloy. Well, those combinations are not explicitly listed in the documenation table for Seebeck coefficients, but even a very small value, like 0.3uV/C adds up to 7.5uV at 25degC. I'm thinking maybe the table values in the NI documentation reffers to the Seebeck values at 25C?
Project Engineer
LabVIEW 2009
Run LabVIEW on WinXP and Vista system.
Used LabVIEW since May 2005
Certifications: CLD and CPI certified
Currently employed.

Seebeck EMV needs temperature gradients , in your relays you hopefully have low temperature gradients ... however in a switching contact you can have all kind diffusions and 'funny' effects, keeping them on same temperature is the best you can do.
Since you work with a multiplexer and with TCs, you need a good Cold junction ( for serious calibrations at 0°C ) and there is the good place for your short cut to measure the zero EMV. Another good test is loop the 'hot junction' back to the cold junction and observe the residual EMV. Touching (or heating/cooling) the TC loop gives another number for the uncertainty calculation: the inhomogeneous material of the TC itself..
A good source for TC knowledge:
Manual on the use of thermocouples in temperature measurement,
ASTM PCN: 28-012093-40,
ISBN 0-8031-1466-4
(Page1): 'Regardless
of how many facts are presented herein and regardless of the percentage
retained,
all will be for naught unless one simple important fact is
kept firmly in mind.
The thermocouple reports only what it "feels."
This may or may not the temperature of interest'
Message Edited by Henrik Volkers on 04-27-2009 09:36 AM
Greetings from Germany
Henrik
LV since v3.1
“ground” is a convenient fantasy
'˙˙˙˙uıɐƃɐ lɐıp puɐ °06 ǝuoɥd ɹnoʎ uɹnʇ ǝsɐǝld 'ʎɹɐuıƃɐɯı sı pǝlɐıp ǝʌɐɥ noʎ ɹǝqɯnu ǝɥʇ'

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Thank You,
From

Your technical issues have zero to do with the installers. Whatever is at play is rooted on your system, but you have not provided any specific system info nor crash logs. Pardon me, but "Photoshop is crashing" is a useful as my 88 year old grandma telling me her phone doesn't work...
Mylenium

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Hey WZZZ,
Thanks for the star and kind words.
I'm the de facto Mac guy at my kids' school and we have around 25 iMac Slot Loaders working there. You can imagine they get abused quite a bit. There are 10 running Garage Band in the Music Department. That puts a tremendous strain on the CPU and I'm actually surprised that they run it so well. My son had a 600 iMac running GarageBand, he was complaining that it was getting jumpy and when I looked at it he was running 10 unlocked tracks simultaneously! So now he has an eMac G4 800 and that of course runs a lot better.
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I see references to CPU sensors on 400 iMacs but on the 400 I have here for repair Temperature Monitor reports no sensors. Perhaps there were different versions of the 400.
But very good to hear that the fan is a good idea for CRT related things. Should I keep the fan running-mostly for that hard core CRT stuff- even if the computer is sleeping and the room temp. is only around 62-64 F.? (We need to put on warm clothes to sit in front of this thing now, but worth it to keep this old machine happy).
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Well the classic failures that I see in the iMac are in this order:
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2) Breakdown of high voltage electolytic capacitors and regular high voltage capacitors on the neck board and PAV supply.
3) Solder problems with the flyback itself. This is diagnosed by the upside down boot technique.
I used to repair these problems but now it's easier for me to swap the Firewire boards into working 350s. I've got 12 of those in the basement currently.
Richard

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